Multi-Wavelength Wafer Inspection System
LX Series
High-speed whole-wafer inspection with multi-wavelength illumination for film thickness, etching, and CD monitoring
Features
High-speed whole-wafer imaging capability ideal for production process monitoring
Uniquely designed multi-wavelength high-brightness and low-noise optical system delivering high sensitivity
Flexible algorithm enabling various analysis capability for film thickness, etching, and CD monitor
High-resolution or high-throughput model available to meet specific application needs
Applications
Monitoring of resist thickness and CD variation and excursion detection during lithography process
Monitoring of various film thickness variation and tool qualification during deposition process
Monitoring of etch depth variation and excursion detection during etching process
