CIRIUS Series
Features
Proprietary optics enabling high sensitivity under-layer defect inspection
Review optics capturing depth information for accurate defect classification
High-throughput inspection
Applications
High sensitivity under-layer defect inspection for 3D NAND and other highly layered IC devices
High sensitivity under-layer defect inspection for bonded wafers
In semiconductor manufacturing, alongside line-width miniaturization, high stacking such as 3D NAND is advancing, and addressing internal defects that occur within devices has become a major challenge.
CIRIUS enables high-sensitivity inspection of internal defects with a proprietary optical system, and achieves identification of the depth position of internal defects through review and classification based on depth information.
This system makes it possible to non-destructively inspect and review internal defects that conventional inspection methods could not handle, contributing to early process improvement and manufacturing cost reduction in customers' production lines.
