BIM Series
Features
Performing accurate measurement of height, width, and depth using confocal optics
Enabling surface profile measurement not only for Si wafer samples but also for transparent samples, including SiC wafers and other compound semiconductor materials, and glass panels
Offering different wavelengths of light including visible light and NIR, enabling the profile measurement of shapes on the surface of wafers as well as those under silicon layers
Applications
3D measurement of Si wafers and compound semiconductor materials, including SiC wafers, and capture of high-resolution review images
Measurement of the height and width of redistribution layers (RDLs) on glass substrates in panel-level packaging processes
Profile measurement of sub-surface patterns and defects inside Si wafers
Specifications
| Sample sizes | 2 inch – 12 inch (300mm) wafers, 500mm – 600mm large panels |
| Other | Fully automated processing compatible with SECS/GEM |
