Mask Defect Inspection Equipment

MATRICS X800LITE Series

Semiconductor mask inspection equipment supporting design nodes ≥28nm

Features

Semiconductor mask inspection system supporting design nodes ≥28nm

Equipped with pixel size 100nm and high-power 213nm QCW laser (>400mW) to achieve high sensitivity

High-speed defect detection system enables scan time of 38 minutes per 100mm×100mm area

Equipped with function to measure and visualize mask pattern dimension distribution (CD uniformity) simultaneously with mask inspection

Supports photomask RSP150 and RSP200

Fully automated inspection possible with OHT (Overhead Hoist Transport) integration

Integrated design of stage system and electrical rack system achieves compact footprint

Applications

Acceptance inspection and regular quality assurance inspection of photomasks at wafer fabs

Pre-shipping inspection in photomask manufacturing processes

MATRICS X800LITE Series

Specifications

Inspection Mode Multi-die mode, Single-die mode
Inspection Scan Time 38 minutes per 100mm×100mm area
Supported Mask Types Cr, MoSi, OMOG
Mask Size 6 inches

The MATRICS X800LITE series is a compact photomask defect inspection equipment. It can be installed even in limited spaces, enabling efficient inspection.

Through its miniaturized design, the X800LITE series provides high-precision defect detection capabilities while reducing installation costs. It is ideal for small to medium-sized mask shops and research and development facilities.