Mask Blank Defect Inspection/Review Equipment

MAGICS Series M6750/M6751

Mask blank defect inspection/review equipment

Features

Latest defect inspection equipment that combines high detection sensitivity required for high-quality mask blank inspection with high throughput suitable for shipping and acceptance inspection at mass production factories

Based on the 63-beam multi-beam scanning method using the confocal optical system, which is the core technology of MAGICS that has become the industry standard for mask blank inspection, equipped with a high S/N defect detection circuit optimized for defects on resist

Improved sensitivity for defects on resist enables high-level and speedy process improvements

M6751 supports Line & Space pattern inspection, as well as foreign particle inspection on latent image patterns after drawing & baking, making it effective for process management in mask shops

Cassettes support from multi-level cassettes for blank manufacturers to RSP, MRP, etc. for mask shops

Applications

Inspection of resist-coated mask blanks, substrates, Cr films, MoSi films, halftone films, and masks with latent image patterns after drawing & baking

Defect review

MAGICS M6750/M6751

Specifications

Inspection Light Source Wavelength 532nm
Detection Sensitivity φ50nm (PSL on quartz substrate, normal mode)
Inspection Time 12 minutes/plate (normal mode, inspection area 142mm×142mm)
Supported Substrate Size 6025

MAGICS M6750/M6751 is the latest model of mask blank defect inspection equipment. It responds to high sensitivity and high throughput requirements, enabling mask blank defect inspection for cutting-edge semiconductors from design rule 5nm generation onwards.

Based on MAGICS core technology, we have significantly improved the defect detection sensitivity for minute defects by refreshing the inspection optical system and adopting the high-speed inspection circuit technology cultivated in our mask pattern inspection equipment.

This latest model achieves high detection sensitivity for defect inspection of EUV mask blanks, photomask blanks, and substrates. It is widely used for shipping inspection at mask blank manufacturers and for acceptance inspection and process management at mask shops.