VIANCA Series
Features
Lasertec's proprietary optics enabling the measurement of the depth of small-diameter, high-aspect-ratio TSVs
Supporting next-generation TSV architectures
Applications
Depth measurement after via etching
Copper recess level control for hybrid bonding
Height measurement after copper pillar revealing and during bump formation
With the development of AI technology, there is a growing demand for higher performance GPUs, and the HBM (High Bandwidth Memory) mounted on GPUs also requires higher performance and miniaturization. The further miniaturization and high aspect ratio of TSV (Through Silicon Via) technology used in HBM manufacturing has become a major challenge.
The VIANCA series uses our proprietary optical system to achieve high aspect ratio small diameter via depth measurement that was impossible with conventional optical systems, enabling high-precision measurement of important quality control items in HBM manufacturing processes such as Cu height measurement after Cu wiring.
We will continue to meet our customers' needs and contribute to quality improvement and yield enhancement in advanced semiconductor processes.
