MAGICS Series M5640
Features
High-sensitivity inspection of killer defects such as PID, shallow scratch, COP, and SF.
High-throughput inspection thanks to 63 scanning laser beams and a specially designed high-speed XY stage.
High-sensitivity inspection of mirror-polished, epitaxial, SOI and quartz wafers.
High-speed, high-resolution defect image review based on confocal optics.
Dust-free marking by diamond indenter for easy navigation and analysis with SEM/AFM.
Selectable wafer handling: Edge grip (non-back-contact) for shipping/receiving; vacuum chuck for evaluation (6/8/12-inch).
Supports FOUP, FOSB and open cassettes.
Applications
Evaluation and improvement of wafer manufacturing process
Outgoing and incoming inspection of wafers
Development of polishing and cleaning materials
Specifications
| Wavelength of inspection light source used for inspection | 532nm |
| Maximum inspection sensitivity | 50 nm (for inspection of PSLs on mirror-polished wafers) |
| Inspection time | 22 minutes per wafer (for 300 mm-wafers, normal scan) |
| Review time | 2 seconds per defect |
Equipped with Lasertec’s core confocal optics, MAGICS has become an industry standard by offering capabilities not available with scattering inspection systems, widely supporting wafer analysis and process improvement.
- High detection sensitivity for killer defects such as PID, shallow scratches, COP and SF
- High-speed, high-resolution review for accurate defect classification
- High-sensitivity inspection of epitaxial and quartz wafers where scattering-based inspection is challenging due to haze and backside reflection
As design rules continue to shrink, quality requirements for wafers are rising and inspection tools must meet higher demands. There is also an increasing need to reduce the types of defects that are difficult to detect with scattering inspection.
M5640 retains the strengths of MAGICS while further improving detection sensitivity and halving inspection time. With an optional backside non-contact chuck, it serves not only for evaluation and analysis but also for outgoing and incoming inspections.
