MAGICS Series M6640S/M6641S
Features
Defect inspection equipment that combines high detection sensitivity required for high-quality mask blank inspection with high throughput suitable for shipping and acceptance inspection at mass production factories
Based on the 63-beam multi-beam scanning method using the confocal optical system, which is the core technology of MAGICS that has become the industry standard for mask blank inspection, equipped with a new defect detection circuit specialized for minute defects
Dramatically improves sensitivity for pinhole defects on MoSi films and Cr films, enabling selection of higher quality blanks
M6641S supports Dense Scan Mode (higher sensitivity inspection mode) and Line & Space pattern inspection, making it effective for various process management in mask shops
Cassettes support from multi-level cassettes for blank manufacturers to RSP, MRP, etc. for mask shops
Applications
Inspection of Qz substrates, Cr films, MoSi films, halftone films, and resist-coated mask blanks
Defect review
Specifications
| Inspection Light Source Wavelength | 532nm |
| Detection Sensitivity | φ50nm (PSL on quartz substrate, normal mode) |
| Inspection Time | 12 minutes/plate (normal mode, inspection area 142mm×142mm) |
| Supported Substrate Size | 6025 |
In 2007, we launched the mask blank defect inspection equipment M6640/41, which is already being used extensively for 100% inspection at many mask blank manufacturers and for acceptance inspection and process management at mask shops. On the other hand, due to delays in the practical application of EUV lithography, photomask miniaturization has progressed, and it has become urgent to manage and improve the quality of mask blanks through even higher sensitivity inspection.
To respond to these next-generation needs, we have developed the latest model M6640S/41S, which maintains high throughput while achieving high detection sensitivity not only for defect inspection of high-quality mask blank quartz substrates, but also for defect inspection of various film formation processes and resist film defect inspection.
M6640S/41S uses the M6640 platform and achieves improved sensitivity for minute defects through newly developed defect detection circuits. Throughput also has equivalent performance to conventional models, and for EUVL mask blanks, it enables high-sensitivity inspection of multilayer and absorber layer defects, and also supports Dual Pod cassettes.
